This is a conductive epoxy with high strength conductive bonding. It is ideal conductive solution for electroforming all types of ceramic, glass and plastics. Can be used also for bonding surface mount connections, track repair and grounding. Cure time: 24 Hrs @ 25°C. Solutions temperature range from -91C to +100C.
– 15 g syringe.
– Resistivity: 0.001 ohm/sm2.
– Thermal conductivity: 11 BTU – in/ft – Hr – F.